2025 Semiconductor Innovation and Intelligent Application Summit (SIIAS)
About SIIAS
Date: 2 December 2025 (Tuesday)
Time: 09:30-17:10
Venue: Grand Hall, 12W, Hong Kong Science and Technology Parks, Hong Kong
Marking a landmark moment for the region, 2025 Semiconductor Innovation and Intelligent Application Summit (SIIAS) proudly present Hong Kong's first international semiconductor summit, co-organized with SEMI and backed by the support of the HKSAR Government. This unprecedented gathering will convene global industry leaders, pioneering researchers, and key policymakers to collectively chart the future of semiconductor innovation and drive the industry's strategic growth.
MEET OUR SPEAKERS
Welcome Remarks
PROF. Tim Cheng
Vice-President for Research and Development
The Hong Kong University of Science and Technology
Mr. LUng CHU
Corporate Vice President
SEMI
Opening Remarks By Guest Of Honour
Prof. Dong SUN, JP
Secretary for Innovation, Technology and Industry
The Hong Kong SAR Government
Keynote SpeAKERS
Mr. Prith Banerjee
Senior Vice President
Simulation & Analysis Incubation Group, Synopsys
Mr. Feng CHEN
Chief Executive Officer
Arm Technology (China) Co., Ltd.
Dr. Teng GAO
Chief Executive Officer
The Hong Kong Mircoelectronics Research and Development Institute (MRDI)
Dr. Michael Jackson
Corporate Vice President and General Manager
System Design and Analysis Group, Cadence
Mr. Choon Khoon LIM
Senior Vice President and Chief Counsel
Advanced Packaging, Semiconductor Solutions Segment, ASMPT
Dr. Young LIN
Chairman and Chief Executive Officer
Fitipower
Dr. Naveed SHERWANI
Chairman
National Semi-Conductor Hub, Saudi Arabia
Prof. Hongtao XU
Co-Founder
ICLEGEND MICRO
