2027 Semiconductor Asia AI Summit (SAAIS)

About SAAIS

Date: 21 January 2026 (Thursday) 
Venue: Grand Hall, 12W, Hong Kong Science and Technology Parks, Hong Kong 

Theme: Advancing Semiconductor Innovation in the AI Era

Following the landmark success of the inaugural Semiconductor Innovation and Intelligent Application Summit (SIIAS), the region’s premier platform for microelectronics returns under an ambitious new banner. Driven by the rapid evolution of artificial intelligence, the rebranded 2027 Semiconductor Asia AI Summit (SAAIS) is set to anchor the global discourse on next-generation computing hardware. 

Taking place in January 2027 at the Hong Kong Science and Technology Park (HKSTP), this highly anticipated event will unite international industry titans, pioneering tech developers, leading academic researchers, and key policymakers. SAAIS 2027 will serve as a vital ecosystem catalyst—showcasing breakthrough silicon architectures, fostering cross-border collaborations, and charting the future roadmap of AI-driven semiconductor design and manufacturing.